Senior Manufacturing Development Engineer
Rising Talent Recruitment Ltd
Are you an experienced Development Engineer with a background in semiconductor, photonics or advanced manufacturing? Do you enjoy taking new products from concept through to production while working on cutting-edge technologies?
Rising Talent Recruitment is working with a global leader in semiconductor packaging and assembly services, to recruit a Senior Manufacturing Development Engineer.
This is an exciting opportunity to join a highly skilled engineering team developing innovative semiconductor and optoelectronic products for customers across a wide range of industries.
The Role
As a Senior Manufacturing Development Engineer, you will play a key role in the design, development and introduction of new semiconductor packaging technologies. You'll combine hands-on engineering with project leadership, working closely with customers and internal teams to deliver high-quality solutions on time and within budget.
Key responsibilities include:
- Designing component packages for semiconductor and photonic devices.
- Developing and optimising assembly processes.
- Supporting hands-on manufacturing and process operations.
- Leading New Product Introduction (NPI) activities from concept through to production.
- Managing technical projects, including planning, scheduling and customer communication.
- Driving continuous improvement through Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA) and Design for Manufacturing (DFM) principles.
- Working collaboratively across engineering, manufacturing and customer teams to deliver successful project outcomes.
About You
We're looking for an engineer who combines strong technical expertise with excellent project management and communication skills.
You'll ideally have:
- A degree in Engineering or a related scientific discipline (or significant equivalent industry experience).
- At least five years' experience within semiconductor and/or optical component manufacturing.
- Practical experience of semiconductor assembly processes including:
- Wafer sawing
- Epoxy and solder die attach
- Wire bonding
- Experience with package sealing, encapsulation or surface mount technologies would be advantageous.
- Mechanical design experience using SolidWorks (or similar CAD software), ideally including thermal or stress modelling.
- Knowledge of DFM, DOE, FMEA and project planning.
- Experience of process engineering, yield improvement and Statistical Process Control (SPC) is desirable.
- Excellent communication skills and the confidence to work directly with customers.
What's in it for You?
In return, you'll receive an excellent package including:
- Competitive salary with annual reviews
- Flexible working and Flexi Time
- 33 days holiday, increasing with service
- Private Medical Insurance
- Life Assurance
- Matched pension contributions up to 6%
- Electric Vehicle Scheme
- Cycle to Work Scheme
- Enhanced maternity and paternity pay
- Company sick pay
- Employee referral scheme
Application opens at the source listing. Free for jobseekers.